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Technical Conference

Substrates and encapsulation II

Date
Thu, Mar 25, 2021
Time
16:00 - 17:00
Chair
16:00 - 16:15 Technical Conference Substrates and encapsulation II

Game-changing Substrates for Conductive Ink Printing

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Plasma nano-coated films for printed electronics
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Pin-hole free fine line printing
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Environmentally friendly, large scale production
Speaker
Co Author
16:15 - 16:30 Technical Conference Substrates and encapsulation II

Reliability enhancement of Printed and Flexible electronics

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An ultra-thin, protective coating
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Chemically inert and halogen free material
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Protection and Reliability for Printed electronics
Speaker
Co Author
16:30 - 16:45 Technical Conference Substrates and encapsulation II

Development of ALD Ceramic and Organometallic thin films for battery and optoelectronic applications

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Atomic Layer Deposition - ALD
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Ultrafast laser welding - flexible glass OLED
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Batteries
Speaker
Co Author
16:45 - 17:00 Technical Conference Substrates and encapsulation II

Q&A