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Technical Conference

Substrates and encapsulation I

Date
Thu, Mar 25, 2021
Time
14:30 - 15:30
Chair
14:30 - 14:45 Technical Conference Substrates and encapsulation I

A large area transparent conducting electrode and its use for automotive interior car heating

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Large area metal mesh foil via R2R fabrication
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New concepts for interior car heating
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Heating, touch sensor, lighting
Speaker
Co Author
14:45 - 15:00 Technical Conference Substrates and encapsulation I

Polyester film substrates for Flexible Electronic applications

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Cost effective ultrabarrier solutions are evolving
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Polyester films can be tailored to meet your needs
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Work with DTF to create FE application solutions
Speaker
Co Author
15:00 - 15:15 Technical Conference Substrates and encapsulation I

Specialty papers as affordable multi-functional material for printed electronics

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Paper for printed electronics
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Specialty paper in electrical applications
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Energy transition with paper
Speaker
Co Author
15:15 - 15:30 Technical Conference Substrates and encapsulation I

Q&A