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Technical Conference

Functional materials

Date
Thu, Mar 25, 2021
Time
16:00 - 18:00
Chair
16:00 - 16:15 Technical Conference Functional materials

Printed piezoelectric sensor architectures from P(VDF-TrFE) to make your surface smart

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printed piezoelectric P(VDF-TrFE)
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condition monitoring
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in-mold electronics
Speaker
Co Author
16:15 - 16:30 Technical Conference Functional materials

Next Generation Copper Ink for Printed Electronics

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New generation of copper ink
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Hot air drying and PET compatible
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Solder-ability and high thermal conductivity
Speaker
16:30 - 16:45 Technical Conference Functional materials

New Developments in the field of conductive and insulation inks

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Inks with high thermal shock and heat stability
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New inks for In-Mold Electronics
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UV-curable silver inks
Speaker
Co Author
16:45 - 17:00 Technical Conference Functional materials

Q&A

17:00 - 17:15 Technical Conference Functional materials

Copper pastes that outperform silver – make the switch. Tips and tricks how to work with nano Copper pastes on multiple substrates such as Paper, PET, PI, FR4, Alumina etc.

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Conductive copper inks that outperform silver.
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Tips and tricks for the printing and sintering.
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Additive manufactured electronics.
Speaker
Co Author
17:15 - 17:30 Technical Conference Functional materials

Next Generation of Advanced Materials for 5G and IT Connectivity

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5G network and IoT connectivity
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transparency, stretchability and conductivity
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Unleash your creativity for connected objects
Speaker
Co Author
17:30 - 17:45 Technical Conference Functional materials

Advances on fully printed piezoelectric devices

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Sensors and actuators
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Large area fully printed devices
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Piezoelectric materials
Speaker
Co Author
17:45 - 18:00 Technical Conference Functional materials

Q&A