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Technical Conference

3D structural electronics

Date
Thu, Mar 25, 2021
Time
13:30 - 15:30
Chair
13:30 - 13:45 Technical Conference 3D structural electronics

Hyb-Man: hybrid manufacturing of integrated electronics for LED lighting

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Development hybrid addtive manufacturing methods
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Modeling to understand product-process relations
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LED lighting product design, making and testing
Speaker
13:45 - 14:00 Technical Conference 3D structural electronics

3D Printed Electronics using SLA for high resolution and throughput

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Emerging technology: 3D printed electronics
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Automotive sensor demonstrator
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Chip packaging demonstrator
Speaker
14:00 - 14:15 Technical Conference 3D structural electronics

Innovative heating technology to control the forming process during the production of 3D-Electronics

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Thermoforming
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Heating System
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Strain Distribution
Speaker
Co Author
14:15 - 14:30 Technical Conference 3D structural electronics

Q&A

14:30 - 14:45 Technical Conference 3D structural electronics

Integration of printed circuits in composites for automotive and aeronautics applications

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Advanced manufacturing
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Reduction of weight
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Functionalized composite
Speaker
Co Author
14:45 - 15:00 Technical Conference 3D structural electronics

Next Generation Electronic Materials for Structural and 3D In-Mold Electronics

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Compatible electronic inks for In-Mold Electronics
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Formable silver inks, dielectric inks & adhesives
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Structural, 3D In-Mold Electronics demonstrators
Speaker
Co Author
15:00 - 15:15 Technical Conference 3D structural electronics

Printing of cleaned copper tracks on 3D printed parts using laser-processing

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3D-printed circuit carrier with primer
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Laser sintering of copper
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Laser cleaning of residual ink
Speaker
Co Author
15:15 - 15:30 Technical Conference 3D structural electronics

Q&A