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Technical Conference

Smart and hybrid systems

Date
Wed, Mar 24, 2021
Time
11:00 - 13:00
Chair
11:00 - 11:15 Technical Conference Smart and hybrid systems

Getting Ready for Natively Flexible Processing Engines

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Flexible ICs
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Machine learning
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Computing
Speaker
11:15 - 11:30 Technical Conference Smart and hybrid systems

Development of a chip foil packaging approach to ease chip integration in flexible hybrid electronics

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Flexible interposer for thinned bare ICs
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Mechanical flexible package with reduced height
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Compatible with roll to roll production
Speaker
Co Author
11:30 - 11:45 Technical Conference Smart and hybrid systems

Development of printed humidity and temperature sensors for smart RFID labels with wireless energy charging and communication functionalities

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RFID UHF printed antenna
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printed temperature and humidity sensors
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tag
Speaker
Co Author
11:45 - 12:00 Technical Conference Smart and hybrid systems

Q&A

12:00 - 12:15 Technical Conference Smart and hybrid systems

Printed heating systems for intelligent window frames

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Smart Frame
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Energy Managment
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Defrosting System
Speaker
Co Author
12:15 - 12:30 Technical Conference Smart and hybrid systems

Hybrid Printed Electronics: Requirements for industrial volume production

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Hybrid printed electronics
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Pick-and-place assembly of SMD on printed foils
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Performance competitiveness of hybrid electronics
Speaker
12:30 - 12:45 Technical Conference Smart and hybrid systems

Bending testing of flex-on-flex anisotropic conductive adhesive interconnections

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Reliability is a crucial factor for commercial use
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Flex attachments were bent up to 100 000 cycles
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Variation was seen between different adhesives
Speaker
Co Author
12:45 - 13:00 Technical Conference Smart and hybrid systems

Q&A